Be competitive, rank your technology, and see what the competition is doing in the following just released structural analysis reports and publications.

Altera Stratix Structural Analysis SAR-0301-001
The Stratix device family is based on a 1.5-V, 0.13-?m, all-layer-copper process technology and offers up to 114,140 logic elements (LEs), 10 Mbits of embedded memory, optimized digital signal processing (DSP) blocks, and high-performance I/O capabilities.

Bosch CMB191 Z-Axis Sensor Structural Analysis SAR-0210-001
The Bosch CMB191 Z-Axis Acceleration Sensor is manufactured using a MEMS (Microelectromechanical Systems) process.

Hall Effect Sensor Focused Technology Review FTR-0210-001
This publication provides structural analyses of the Hall Effect elements of three sensor devices from three different manufacturers.

IBM PPC750FX-CB0513T PowerPC RISC Microprocessor Structural Analysis SAR-0209-002
The IBM PPC750FX-CB0513T PowerPC RISC Microprocessor is fabricated with a 0.13 micron SOI (Silicon On Insulator) process. The device has 32KB of Level 1 cache (data) and 512KB of Level 2 cache.

Previously Released Reports

AMD Athlon 4 Mobile Structural Analysis

Elpida EDD5104ABTA-7A 512Mb DDR SDRAM Structural Analysis

NetLogic NL877313-50 IPCAM Ternary CAM Structural Analysis

Samsung K4H560838C-TCA2 256M DDR SDRAM Structural Analysis

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