Group A

Embedded DRAM - FTR 0206-004
This first ever study of real world implementations of embedded DRAM provides some background on the issues and detailed analysis of some current products.

Embedded SRAM - FTR 0205-002
A comparative analysis of 13 different devices from 11 different manufacturers. This study of Microprocessor, DSP and other types of semiconductor devices looks at real world implementations of embedded SRAM technology.

On-Die Interconnect Technology - FTR 0206-003
A comparative analysis of 19 different devices from 6 different manufacturers. On-Die Interconnect is an invaluable resource in providing a comparison between different manufacturers backend interconnect processes

Shallow Trench Isolation - FTR 0205-001
A comparative analysis of 20 different devices from 14 different manufacturers. This comparative study provides real world examples of how the STI process has been implemented by a number of different manufacturers.

Group B

FLASH Memory Cells - FTR 9912-007
This report describes a comparative analysis of Flash and EEPROM cells on fourteen different devices by twelve manufacture's

Comparative Analysis of Flip-Chip Technology - FTR 9912-001A
Fifteen devices using Flip-Chip Technology from seven different manufacturer's are analyzed.

New Designs for Wirebond Pads - FTR 9906-006
This report describes a comparative analysis of new designs for wirebond pads on thirteen different devices by ten manufacturer's.
 

Group C

Comparative Analysis of High Speed Buffers - FTR 0111-001
Selected from Chipworks library of Circuit Analysis, this report provides a comparative analysis of the Input and Output Buffers of 14 different devices from 12 different manufacturers.

Comparative Analysis of Interlevel Dielectric (ILD) and Metalization Technologies
Products included in the analysis are DRAMS, microprocessors and general logic.

New Technologies and Trends in Non-Volatile Memory
Learn about the present state of the non-volatile memory market and the new FeRAM and MRAM technologies.

Successful Technologies Review 2001 (STR)
A compilation of the latest "delivered" technologies, this report contains photographic illustrations (typically die photos and cross sections) for each product included, as well as a description of the technology, comments on manufacturing quality and comparison tables of design rules, layer thickness, and materials employed.
 

Group D

Analog to Digital Converter
This report will provide an analysis of 6 different analog-to-digital converter (ADC) circuits from 6 different manufacturers. The circuits selected will represent a variety of ADC types.

Phase Locked Loop (PLL) - FTR 0206-001
Intended for circuit designers, technicians and project managers, this comparative study provides real world examples of how PLL circuitry has been implemented by a number of different manufacturers. See what your competition is doing with regards to PLL design today.
 

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