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Program Licensing | Interconnects
and Dielectrics | New Reports | Conferences
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By Chuck Neuenschwander,
Principal, Patent Solutions
If your company deals with cutting edge technology chances are that
you will be confronted at some time or another with a patent licensing
dispute. These disputes arise out of two different kinds of situations:
• defensive
licensing
• proactive or assertive licensing campaigns
Usually the
first encounter with a licensing negotiation arises out of a defensive
situation, that is, a company is being charged with infringing a
competitors patents. The company is then faced with either paying
a significant royalty on its product and/or a costly lawsuit. This
is usually the wake-up call to management that they should be asserting
their intellectual property rights against others in their industry
rather than constantly being on the defensive.
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patent licensing (charging someone with infringement) is usually
an outgrowth of management strategy. It can however entail
significant financial costs. A company must allocate human
resources to various tasks such as reviewing patents, examining
potential prior art problems, and developing settlement strategies.
In addition there will be significant external costs for reverse
engineering, legal consultations, travel expenses, and, finally,
potential litigation expenditures. For these reasons, more
and more corporations are outsourcing their licensing programs
to external companies that specialize in this area. Ideally,
these external companies should also have access to their
own legal and reverse engineering resources. con't |
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By Dick James, Senior Technical Advisor
In the Spring of 2002, Chipworks published an article
entitled Interconnect & Dielectric Technologies: What’s
really going on?. It was based on our then experience in this technology
arena. We received a lot of feedback on this article and decided
to provide our readers with a follow up. Feedback is an important
part of articles like this, and we appreciate your comments.
We have had an ongoing discussion on what constitutes
“low-k”. The consensus seems to be that true “low-k”
processing uses dielectrics with k-values of 3 or less, and FSG
(fluorinated glass with k ~3.6) is merely “lower-k”.
130
nm processes are now much more prevalent, but despite much media
hype last year, they have not had an easy introduction. Many suppliers
have had difficulties in ramping production with decent yield, and
there have been embarrassing slowdowns in deliveries of high-end
products. These delays have one main cause - trouble with integrating
low-k dielectrics into processes newly developed with copper metallization.
IBM seems to be capitalizing on these problems and is picking up
business from some of TSMC’s and UMC’s customers.
con't
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Please contact
Rick Patricio by e-mail at info@chipworks.com,
phone +1.613.829.0414 or fax +1.613.829.0515 for more details
on Standard Reports release dates and prices, or visit our website
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for a list of all available reports.
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In today’s
highly competitive market, it is important to maximize your
knowledge of the latest electronic devices available. Our
timely reports will provide you with a convenient and effective
way to keep informed of innovations in semiconductor technology.
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Broadcom BCM2050 2.4 GHz Radio Single Chip Full Circuit Analysis
Broadcom's
new offering is a two-chip, all CMOS solution that employs
a direct conversion architecture and is the most integrated,
highest performing 2.4 GHz solution available in the industry.
The new Broadcom BCM4306 baseband/MAC (media access controller)
chip combines with the BCM2050 2.4 GHz radio to enable 54
Mbps connectivity in the 2.4 GHz radio frequency band. See
what our analysis found inside.
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Chipworks Inside the 2003 McClean Report
Chipworks
is pleased to announce that it has received significant mention
in The 2003 McClean Report. This publication, produced by
IC Insights, is a recognized standard for its complete analysis
and forecast of the IC industry. It is regularly referred
to by analysts and trade media worldwide. For additional information
on the 2003 McClean Report visit www.icinsights.com.
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